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• Lasch, Rainer , Dresden University of Technology
• Lavigne, Erin , IBM Corporation
• Le Cunff, Delphine , STMicroelectronics
• Le Denmat, Jean-Christophe , ST Microelectronics
• Lebreton, Julie , STMicroelectronics
• LeBritton, Joe , Mentor Graphics Corporation
• Lee, Byoung-Ho , Ultratech
• Lee, Hong-Ji , Macronix International Co., Ltd.,
• Lee, Jong Hyup , Globalfoundries
• Lee, K.W. , Tohoku University
• Lee, Rinus T.P. , SEMATECH
• Lee, Shih-Chin , Macronix International Co., Ltd.,
• Lei, Chris , Hermes Microvision Inc.
• Lei, Ming , GLOBALFOUNDRIES
• Lei, Shuen-Cheng Chris , Hermes Microvision Inc.
• Leibold, Andreas , Fraunhofer Institute for Integrated Systems and Device Technology
• Lennox, Chet , KLA-Tencor
• Lepelletier, Guillaume , STMicroelectronics
• Leray, Philippe , KLA Tencor
• Levi, Shimon , Applied Materials
• Li, Jian , GLOBALFOUNDRIES
• Lian, Nan-Tzu , Macronix International Co., Ltd.,
• Lim, Kok Hui , Micron Technology, Inc
• Lim, Wi Hoong , Micron Technology, Inc
• Lin, Hong , IBM